Separable wire bundle

ABSTRACT

A wire bundle including a plurality of insulated wires forming a bundle having a chosen length, wherein the wires are disposed substantially parallel to one another and are joined together along the chosen length by a connecting material which is capable of being torn without the use of tools, such that the wires can be separated from one another without affecting the insulation thereof along at least a portion of the chosen length is described. Such a wire bundle permits the connection of wires to integrated circuits having small-pitch connection pins to be more readily made. By forming an electrical contact between one wire in the wire bundle and a connector pin of the integrated circuit by soldering, as an example of a connection process, the other wires in the bundle are automatically aligned and stabilized with respect to the other connector pins of the integrated circuit. Soldering of these other connections can then be more readily accomplished.

FIELD OF THE INVENTION

The present invention relates generally to connecting wires tointegrated circuits and, more particularly, to a readily separable wirebundle for electrically connecting wires to integrated circuits.

BACKGROUND OF THE INVENTION

Integrated circuits components (ICs) are being produced in smaller-sizedpackages to accommodate demands for miniaturization of productsutilizing such components. Development of proof-of-concept, breadboarddesigns making using these small-pitch ICs has as a result become moredifficult, since electrically connecting wires thereto by soldering, asan example, has become increasingly challenging.

Hand soldering wires to the small pitch ICs in bread-board applicationsoften has the undesirable effect of not allowing for clean soldering ofindividual wires. Moreover, it is difficult to position a wire in placewhen soldering, and the heating of one wire may undesirably releaseanother wire already in place on the IC. Tape might be used to holdindividual wires together while soldering, but this has the disadvantageof making it difficult to properly align individual wires, and tapeadhesive may be difficult to remove with the remaining adhesive havingpoor dielectric properties. Thus, implementing changes in the wiringpattern for small-pitch ICs has become more difficult.

Existing wire bundles, such as those used in multi-pin connectors, as anexample, cannot be readily separated. It is undesirable to use a knifeor scalpel to separate the wires in the bundle, since it is possible tocut through the wire insulation and into the wires themselves whenworking with wire bundles having small wire pitches and small wirediameters, perhaps even destroying wire electrical continuity.

Accordingly, it is an object of the present invention to provide anapparatus for more effectively attaching wires to small-pitch integratedcircuit components.

Another object of the invention is to provide a method for attachingwires to small-pitch integrated circuits.

Additional objects, advantages and novel features of the invention willbe set forth, in part, in the description that follows, and, in part,will become apparent to those skilled in the art upon examination of thefollowing or may be learned by practice of the invention. The objectsand advantages of the invention may be realized and attained by means ofthe instrumentalities and combinations particularly pointed out in theappended claims.

SUMMARY OF THE INVENTION

To achieve the foregoing and other objects of the present invention, andin accordance with its purposes, as embodied and broadly describedherein, the separable wire bundle hereof includes: a plurality ofspaced-apart neighboring wires forming a bundle having a chosen length,wherein the wires are disposed substantially parallel to one another; amaterial suitable for providing electrical insulation surrounding eachwire; and a connecting material capable of being torn without the use oftools such that each wire is joined to at least one neighboring wirealong the chosen length and each wire can be separated from itsneighboring wires without affecting the insulation or electricalcontinuity thereof along at least a portion of the chosen length.

In another aspect of the invention and in accordance with its objectsand purposes, the method for connecting wires to the connector pins ofan integrated circuit having a pitch, hereof includes the step ofelectrically connecting one wire from a plurality of spaced-apartneighboring wires forming a wire bundle having a chosen length, whereinthe wires are disposed substantially parallel to one another, whereineach wire is surrounded by a material suitable for providing electricalinsulation therefor, and wherein each wire is attached to at least oneneighboring wire along the chosen length by a connecting material whichis capable of being torn without the use of tools, such that each wirecan be separated from the at least one neighboring wire withoutaffecting the insulation and electrical continuity thereof along atleast a portion of the chosen length, to one connector pin of theintegrated circuit, such that the wire bundle is stabilized, and otherwires in the wire bundle are aligned with the connector pins of theintegrated circuit.

Benefits and advantages of the present invention include, but are notlimited to, the ability to access only the number of wires needed tomatch the pin count of the IC being used; the automatic alignment of thewires with the IC; a reduction in the effort needed to attach each wireusing soldering means since the wires in practice are held in place; thewires can be separated after attachment to the IC; and mechanicalstrength is added to the solder bond by unseparated wire connectingmaterial.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and form a part ofthe specification, illustrate embodiments of the present invention and,together with the description, serve to explain the principles of theinvention. In the drawings:

FIG. 1 a is a schematic representation of an end-on view of anembodiment of the wire bundle of the present invention, while FIG. 1 bis a schematic representation of a projection view thereof.

FIG. 2 a is a schematic representation of a top view of an integratedcircuit holder adapted to receive the wire bundle shown schematically inFIG. 1 a hereof and an integrated circuit to which at least one of thewires in the bundle of the present invention is to be attached, FIG. 2 bis a schematic representation of the front view thereof, and FIG. 2 c isa schematic representation of a side view thereof.

DETAILED DESCRIPTION

Briefly, the present invention includes a plurality of insulated wireshaving a chosen pitch, where pitch is defined for the purposes hereof asthe distance between signal carrying conductors. Pitch may also bedefined for the purposes hereof as the distance between pins of anintegrated circuit (IC). The plurality of insulated wires are joinedtogether along their length by a connecting material which may be formedfrom the insulating material surrounding the wires, as an example, orusing another material, forming thereby a bundle of wires. Theconnecting material is adapted to be readily torn such that the wirescan be separated from one another without adversely affecting theinsulation of the wires, if desired, yet provide sufficient strength tokeep the wires together in useful lengths. The wire bundle might bewound on a spool, as an example, from which desired lengths could becut. In an embodiment of the invention, the wire connecting material isperforated for ease of separation. It is desirable that the wires can beseparated without the use of tools without affecting the quality ofinsulation surrounding the wires. In the situation where the separatingmaterial is fabricated from the insulating material, either perforatedor non-perforated, the insulating/connecting material is selected tohave desired dielectric properties while being readily torn. Extrudedpolytetrafluoroethylene (PTFE), having a 0.013 (0.33 mm) wall thickness,or a polymer of tetrafluoroethylene and perfluorovinyl ether (PFA),having a 0.013 in. (0.33 mm) wall thickness, are representative examplesof suitable insulating/connecting materials.

For the application of soldering wires to ICs, the wire bundle should besubstantially planar; however, different geometries may be contemplatedfor other purposes.

The method of the present invention permits the wires to automaticallyremain in alignment with the connector pins of an IC as a result of theaction of the connecting material in stabilizing and aligning the wiresin the wire bundle, once one wire is connected thereto. This leads toreduced effort for attaching each wire using a soldering station sincethe wires practically hold themselves in place. Although it isanticipated by the inventors that the wires will be brought intoelectrical contact with the connector pins of the integrated circuit bya soldering process, other attachment methods which provide electricalcontinuity and stability of the resulting attachment may be used. Ifdesirable, the wires can be separated after attachment to the IC, whilea small section of the perforated spacer material might be left intactto add mechanical strength to the solder bond. It is anticipated thatthe wire bundle of the present invention will be provided having chosenpitches and chosen wire diameters adapted to match the connector spacingof commonly available ICs. The present invention also permits theremoval from the wire bundle of only the number of wires needed to matchthe connector pin count of the IC.

As will be described hereinbelow, the present invention may be used inconjunction with an IC holder that aligns the wire with the IC.

Reference will now be made in detail to the present preferredembodiments of the invention examples of which are illustrated in theaccompanying drawings. In what follows, identical callouts will be usedfor similar or identical structure. Turning now to the figures, FIG. 1 ais a schematic representation of an end-on view of wire bundle, 10, ofthe present invention, while FIG. 1 b is a schematic representation of aprojection view thereof. Shown in FIGS. 1 a and 1 b are bundle 10 in itsplanar embodiment with wires, 12, bearing insulation, 14, part of whichis used to form connecting material, 16, which attaches the wires to oneanother along their lengths, thereby orienting the wires in a parallelconfiguration with neighboring wires. Perforations, 18, in connectingmaterial 16, shown in FIG. 1 b, assist in the separation of the wireswithout the need for tools.

In the practice of the method of the present invention, wire bundle 10would be chosen such that the pitch, P, of wires 12 is substantially thesame as the spacing of the connector pins for the IC for which wireattachment is to be performed. The appropriate diameter, D, for wires 12would also be chosen. As an example, the wire diameter could be chosento match the cross sectional dimension of the IC connector pins. Onewire of wire bundle would be placed in electrical contact with aconnector pin of the IC, by soldering, as an example of performing thisstep. As a result, the wire bundle would be stabilized and the otherwires could readily be soldered to the matching connector pins on theIC. The attached wires might then be separated from the wire bundle, ifdesired, or used to connect to the pin connectors of other ICs. Thedesired length, L, of the connected wires is achieved by cutting thewires from a spool onto which the wire bundle is wound or by cutting thewire bundle to the desired length before the connection procedure isundertaken.

In another example of the use of the wire bundle of the presentinvention, FIG. 2 a is a schematic representation of a top view of anintegrated circuit holder, 20, adapted to receive wire bundle 10 and oneor more ICs, 22. Clamp, 24, is used to hold IC 22 in place while wirebundle 10 is held in place using wire clamp 26. Pins, 28, of IC 22 aresuspended in open cavities, 30, of IC holder 20 which allows wires 12 tobe soldered or otherwise electrically connected to IC connector pins 28.The connected IC can then be removed from IC holder 20 with theappropriate number of wires attached to selected pins thereof, byreleasing straps 24 and 26.

FIG. 2 b is a schematic representation of the front view thereof, andFIG. 2 c is a schematic representation of a side view thereof.

The foregoing description of the invention has been presented forpurposes of illustration and description and is not intended to beexhaustive or to limit the invention to the precise form disclosed, andobviously many modifications and variations are possible in light of theabove teaching.

The embodiments were chosen and described in order to best explain theprinciples of the invention and its practical application to therebyenable others skilled in the art to best utilize the invention invarious embodiments and with various modifications as are suited to theparticular use contemplated. It is intended that the scope of theinvention be defined by the claims appended hereto.

1. A separable wire bundle comprising: a plurality of spaced-apartneighboring wires, each of said wires having a first end and a secondend, and forming a bundle having a chosen length wherein at least one ofsaid first end and said second end are exposed, and, wherein said wiresare disposed substantially parallel to one another; a material suitablefor providing electrical insulation surrounding each wire of saidplurality of wires; and grooveless connecting material having a singleline of perforation and capable of being torn without the use of toolssuch that each of said wires in said plurality of wires is joined to atleast one neighboring wire along the chosen length and each of saidwires can be separated from said at least one neighboring wire withoutaffecting the insulation or electrical continuity thereof along at leasta portion of the chosen length.
 2. The wire bundle of claim 1, whereinsaid connecting material is formed from said electrical insulatingmaterial surrounding said wires.
 3. The wire bundle of claim 2, whereinsaid insulating material is selected from the group consisting ofpolytetrafluoroethylene and a polymer comprising tetrafluoroethylene andperfluorovinyl ether.
 4. (canceled)
 5. The wire bundle of claim 1,wherein said plurality of neighboring wires is substantially planar. 6.The wire bundle of claim 5, wherein each of said wires in said pluralityof neighboring wires has a chosen diameter and is separated a chosendistance from neighboring wires in said wire bundle such that saidplurality of neighboring wires in said wire bundle substantially matchthe cross section and pitch of the pins of an integrated circuit towhich said wires are to be electrically connected.
 7. The wire bundle ofclaim 6, wherein only the number of wires needed to match the number ofconnector pins for which connections are to be made to the integratedcircuit are separated from said wire bundle.
 8. The wire bundle of claim7, wherein a portion of said connecting material along the chosen lengthis left unseparated.
 9. The wire bundle of claim 1, wherein said wirebundle is adapted to be wound onto a spool such the chosen length ofsaid wire bundle may be achieved by cutting the chosen length from saidwound wire bundle.
 10. A method for connecting wires to the connectorpins of an integrated circuit, the connector pins having a pitch and across section, comprising the step of electrically connecting one wirefrom a plurality of spaced-apart neighboring wires forming a wire bundlehaving a chosen length and a wire pitch chosen to match the pitch of theconnector pins, wherein the wires are disposed substantially parallel toone another, wherein each wire is surrounded by a material suitable forproviding electrical insulation therefor, and wherein each wire isjoined to at least one neighboring wire along the chosen length by aconnecting material which is capable of being tom without the use oftools, such that each wire can be separated from the at least oneneighboring wire without affecting the insulation and electricalcontinuity thereof along at least a portion of the chosen length, to oneconnector pin of the integrated circuit, thereby stabilizing the wirebundle and aligning other wires in the wire bundle with pins of theintegrated circuit.
 11. The method of claim 10, further comprising thestep of electrically connecting other wires to integrated circuitconnector pins with which they are aligned.
 12. The method of claim 11,wherein said step of electrically connecting one wire to one pin of saidintegrated circuit, and wherein said step of electrically connectingother wires to connector pins with which they are aligned are performedby soldering.
 13. The method of claim 10, wherein the connectingmaterial is formed from the insulating material surrounding the wires.14. The method of claim 13, wherein said insulating material is selectedfrom the group consisting of polytetrafluoroethylene and a polymercomprising tetrafluoroethylene and perfluorovinyl ether.
 15. The methodof claim 13, wherein the separating is perforated for ease of separationthereof.
 16. The method of claim 10, wherein the plurality ofneighboring insulated wires is substantially planar.
 17. The method ofclaim 16, wherein each of the wires in the plurality of neighboringwires has a chosen diameter and is separated a chosen distance fromneighboring wires in the wire bundle such that each wire in theplurality of neighboring wires substantially matches the cross sectionand pitch of the connector pins of the integrated circuit.
 18. Themethod of claim 17, wherein only the number of wires needed to match thenumber of connector pins for which connections are to be made to the ICare separated from the wire bundle.
 19. The method of claim 18, whereina portion of the connecting material along the chosen length is leftunseparated.
 20. The method of claim 10, further comprising the steps ofwinding the wire bundle on a spool, and cutting the chosen length fromthe wound wire bundle.